Director PostFab Engineering

GlobalFoundries is seeking a Director of Advanced Packaging Development to lead the development and industrialization of advanced packaging solutions for next-generation silicon photonics and optical interconnect products. This leader will be responsible for driving internal packaging development activities while serving as the primary interface to external OSATs, suppliers, ecosystem partners, and key customers.

The successful candidate will partner closely with Product Line Management, Business Development, and engineering organizations to define packaging technology roadmaps, develop differentiated solutions, and enable commercialization of future products. This role requires a unique combination of technical leadership, team development, customer engagement, business partnership, and external ecosystem management.

Essential Responsibilities:

Technical and Organizational Leadership

• Lead the advanced packaging development organization responsible for package architecture, assembly processes, qualification strategy, manufacturing readiness, and product industrialization.
• Build and develop a high-performing team focused on technical excellence, innovation, and execution.
• Drive technology decisions related to package design, materials, thermal management, reliability, manufacturability, and cost optimization.
• Establish development methodologies, design guidelines, and qualification strategies to support product scale-up and commercialization.

Roadmap and Strategy

• Define and maintain the advanced packaging technology roadmap supporting silicon photonics, optical interconnect, co-packaged optics, AI networking, and future platform developments.
• Align packaging investments and development priorities with product roadmaps, customer requirements, and business objectives.
• Evaluate emerging technologies, market trends, and supplier capabilities to maintain GlobalFoundries' competitive position.
• Drive strategic decisions on technology selection, capability development, and manufacturing approaches.

Customer and Business Engagement

• Partner with Product Management and Business Development to shape future product and technology strategies.
• Engage directly with customers to understand technology requirements, packaging challenges, and long-term roadmap needs.
• Represent GlobalFoundries during customer technical reviews, roadmap discussions, executive briefings, and development engagements.
• Support customer acquisition and growth initiatives by translating customer requirements into differentiated packaging solutions.
• Build trusted relationships with customers, OSATs, suppliers, and ecosystem partners to accelerate business growth and technology adoption.

External Partner Management

• Serve as the primary technical and business interface to OSATs, assembly partners, material suppliers, and strategic ecosystem collaborators.
• Lead joint development activities with external partners to enable future product platforms.
• Drive alignment on development schedules, technical milestones, qualification plans, and manufacturing readiness.
• Develop scalable manufacturing and sourcing strategies supporting both development and high-volume production.

Program Execution

• Lead cross-functional execution across design, process integration, reliability, product engineering, manufacturing, quality, procurement, and supply chain teams.
• Identify and mitigate technical, schedule, cost, supply chain, and manufacturing risks.
• Communicate program status, investment recommendations, and strategic priorities to senior leadership.
• Ensure successful transition of packaging technologies from development into production.

Required Qualifications

• BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related discipline.
• 15+ years of experience in semiconductor packaging, advanced packaging, photonics packaging, or related technologies.
• Demonstrated experience leading complex technology development organizations and multidisciplinary engineering teams.
• Strong knowledge of advanced packaging technologies including flip-chip assembly, wafer-level packaging, optical packaging, high-density interconnects, thermal management, and reliability qualification.
• Experience working directly with OSATs, outsourced manufacturing partners, and semiconductor supply chains.
• Proven ability to lead strategic customer engagements and external partnerships.
• Excellent communication, leadership, and executive presentation skills.

Preferred Qualifications

• Experience with silicon photonics, optical engines, optical interconnects, or co-packaged optics.
• Experience supporting hyperscale, networking, telecommunications, AI, or datacenter applications.
• Track record of building and scaling high-performing engineering organizations.
• Experience managing technology roadmaps, strategic investments, and customer-facing development programs.

Role Impact

This position will provide end-to-end leadership for advanced packaging technology development, external manufacturing partnerships, customer engagement, and roadmap execution. The Director will play a critical role in enabling future silicon photonics products, strengthening strategic customer relationships, and positioning GlobalFoundries as a leader in advanced photonics packaging solutions.

Expected Salary Range

The exact Salary will be determined based on qualifications, experience and location.