Package Design Engineer

Аbout GlobalFoundries 

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. 
 

Key Responsibilities: 

• Support the design of advanced packages for high-speed optical interconnect and networking products under the guidance of senior packaging engineers, contributing to layout, floorplanning, and design documentation.
• Assist in developing substrate routing and interconnect for FCBGA/FCCSP, organic substrate, and 2.5D/3D package architectures supporting Co-Packaged Optics (CPO) and pluggable optics.
• Perform package layout tasks using industry-standard EDA/package design tools, and help maintain design libraries, stack-ups, and documentation.
• Assist with signal and power integrity checks, design rule checks, and basic controlled-impedance and differential-pair routing under supervision.
• Support data collection and analysis for package characterization, reliability evaluation, and design verification activities.
• Participate in design reviews, capture action items, and help track design deliverables and schedules.
• Collaborate with cross-functional design, assembly, test, and manufacturing teams to learn end-to-end package development flows.
• Continuously build technical expertise in advanced packaging technologies, high-speed interconnect design, and optical packaging fundamentals.

Required Qualifications:

• BS or MS in Electrical Engineering, Mechanical Engineering, Packaging Engineering, or a related discipline.
• 0–2 years of experience in semiconductor package design, PCB design, or related work (internships, co-ops, and academic projects considered).
• Foundational understanding of semiconductor packaging concepts such as FCBGA/FCCSP, organic substrates, interposers, and flip-chip assembly.
• Basic knowledge of high-speed signaling concepts, including transmission lines, controlled impedance, and differential pairs.
• Exposure to EDA, package/PCB layout, or simulation tools.
• Familiarity with data analysis or scripting tools such as Python or MATLAB is a plus.
• Strong analytical, problem-solving, and organizational skills, with attention to detail.
• Good communication skills and eagerness to learn in a collaborative, cross-functional environment.
• Self-motivated, adaptable, and able to take direction while growing technical independence.

We Offer 

• Base Salary
• Equity
• Annual Bonus Plan
• Medical Insurance