Digital Design Engineer
Аbout GlobalFoundries
GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Responsibilities
Develop, document, and maintain RTL (SystemVerilog/Verilog) for digital subsystems within the CPO product, including control logic, register interfaces, link management, and DFT structures.
Collaborate with architecture, analog/mixed-signal, and photonics teams to define digital interfaces and control schemes for co-packaged optical modules.
Own micro-architecture specifications, design reviews, and integration of digital IP into the top-level SoC.
Drive synthesis, timing closure, CDC, lint, and low-power (UPF) sign-off in coordination with the physical design team.
Perform FPGA prototyping and testing of digital subsystems to validate functionality, accelerate pre-silicon software bring-up, and de-risk RTL ahead of tape-out.
Develop and execute UVM-based testing, including building reusable verification components, writing constrained-random tests, and driving functional and code coverage closure.
Support verification efforts by collaborating with the DV team on testbench development, coverage closure, and debug.
Participate in tape-out readiness activities, including ECO planning, gate-level simulation, and post-silicon bring-up support.
Contribute to design methodology, reuse strategy, and quality improvements across the team.
Required Qualifications
Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field.
1+ years of experience in digital RTL design using SystemVerilog/Verilog.
Solid understanding of digital design fundamentals: synchronous design, CDC, FSMs, pipelining, and low-power techniques.
Hands-on experience with industry EDA tools (synthesis, lint, CDC, simulation).
Familiarity with scripting (Python, TCL, Perl) for design automation.
Strong problem-solving skills and ability to work in a cross-functional team.
Preferred Qualifications
Experience with high-speed serial interfaces (SerDes, PCIe, Ethernet, CXL) or optical link control.
Exposure to silicon photonics, co-packaged optics, or advanced packaging products.
Experience with ARM-based SoC integration, AMBA protocols (AXI/AHB/APB), and standard IP integration flows.
Prior tape-out experience on advanced process nodes.
Knowledge of UPF/low-power flows and DFT (scan, MBIST, boundary scan).
We Offer
Base Salary
Equity
Annual Bonus Plan
Medical Insurance
Information about our benefits you can find here: https://gf.com/careers/opportunities-in-europe/
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